CIBC

2027 Summer Intern - Software Engineering

Chicago, IL, United StatesSWEStarts Summer 2027$36–40/hNo visa sponsorshipGrad 2026–27

About this internship

CIBC is hiring for an internship in software engineering, based in Chicago, IL, United States. It starts in Summer 2027. The employer published it on 4 September 2026. Applications go through CIBC's own careers site.

What the posting asks for

  • Graduating in 2026 or 2027
  • No visa sponsorship
  • Tools mentioned: Python, SQL

How hard is it to get?

Our ease score for this internship is 50/100. It is an estimate from public signals (employer, desk, programme, city, how recent the posting is, number of openings), not an admission rate. The factors that weigh most:

  • -5 flagship summer programme
  • -4 open for 48 days: many applications are already in
  • -3 software internships draw many applicants

Key facts

Employer
CIBC
Location
Chicago, IL, United States
Desk
Software Engineering
Contract
Internship
Start
Summer 2027
Pay
$36–40/h (as stated in the posting)
Posted
4 September 2026
Ease score
50/100 (estimate)

Facts taken from CIBC's careers site, checked every 3 hours. The full posting, and the application, are on the employer's site.