Intel

Silicon Hardware Engineering - Intern, Bachelor’s

US, Oregon, Hillsboro, United States / US, California, Folsom / US, California, Santa Clara / US, Texas, Austin / +1 moreHWStarts Summer 2027

About this internship

Intel is hiring for an internship in hardware and chip design, based in US, Oregon, Hillsboro, United States / US, California, Folsom / US, California, Santa Clara / US, Texas, Austin / +1 more. It starts in Summer 2027. The employer published it on 2 September 2026. Applications go through Intel's own careers site.

What the posting asks for

  • Bachelor's level

How hard is it to get?

Our ease score for this internship is 65/100. It is an estimate from public signals (employer, desk, programme, city, how recent the posting is, number of openings), not an admission rate. The factors that weigh most:

  • -4 open for 50 days: many applications are already in
  • +4 6 openings on this desk at Intel
  • +3 hardware roles draw fewer applicants

Key facts

Employer
Intel
Location
US, Oregon, Hillsboro, United States / US, California, Folsom / US, California, Santa Clara / US, Texas, Austin / +1 more
Desk
Hardware & Chips
Contract
Internship
Start
Summer 2027
Posted
2 September 2026
Ease score
65/100 (estimate)

Facts taken from Intel's careers site, checked every 3 hours. The full posting, and the application, are on the employer's site.