Intel

Silicon Hardware Engineering - Intern, Graduate

US, Oregon, Hillsboro, United States / US, California, Folsom / US, California, Santa Clara / US, Texas, Austin / +1 moreHWStarts Summer 2027$106k/yr

About this internship

Intel is hiring for an internship in hardware and chip design, based in US, Oregon, Hillsboro, United States / US, California, Folsom / US, California, Santa Clara / US, Texas, Austin / +1 more. It starts in Summer 2027. The employer published it on 2 September 2026. Applications go through Intel's own careers site.

What the posting asks for

The posting names no specific language, degree, graduation year or visa condition. Read it in full before applying.

How hard is it to get?

Our ease score for this internship is 65/100. It is an estimate from public signals (employer, desk, programme, city, how recent the posting is, number of openings), not an admission rate. The factors that weigh most:

  • -4 open for 50 days: many applications are already in
  • +4 6 openings on this desk at Intel
  • +3 hardware roles draw fewer applicants

Key facts

Employer
Intel
Location
US, Oregon, Hillsboro, United States / US, California, Folsom / US, California, Santa Clara / US, Texas, Austin / +1 more
Desk
Hardware & Chips
Contract
Internship
Start
Summer 2027
Pay
$106k/yr (as stated in the posting)
Posted
2 September 2026
Ease score
65/100 (estimate)

Facts taken from Intel's careers site, checked every 3 hours. The full posting, and the application, are on the employer's site.